Comodo SSL

LED Lamps


Portfolio

5630WSMD LED front view
SPW5630 SMD LED

5.6*3.0 mm White SMD LED

5050SMD-LED-front-view
SPB5050 SMD LED

5.0*5.0 mm Blue SMD LED

3528SMD-LED-front-view
SPR3528 SMD LED

3.5*2.8mm red SMD LED

HRGB High Power LED
HRGB High Power LED

RGB 1W & 3W High Power LED

H1W High Power LED
H3W High Power LED

3.0 Watt High Power LED

H1W High Power LED
H1W High Power LED

1.0 Watt High Power LED

H0.5W High Power LED
H0.5W High Power LED

0.5 Watt High Power LED

3020SMD LED front view
SPY3020 SMD LED

3.0*2.0mm Yellow SMD LED

3020SMD LED front view
SPR3020 SMD LED

3.0*2.0mm Red SMD LED

3020WSMD LED front view
SPW3020 SMD LED

3.0*2.0mm White SMD LED

PHYG326A-DIP-LED-light-view
PHYG326A DIP LED

Round Head,2 Pins, Diameter:3.0mm Yellow Green DIP LED

PPR326A-DIP-LED-light-view
PPR326A DIP LED

Round Head,2 Pins, Diameter:3.0mm Red DIP LED

PHRB322A-DIP-LED-red-light-view
PHRB322A DIP LED

Round Head,3 Pins, Diameter:3.0mm Red & Blue DIP LED

PHG23450Z-DIP-LED-light-view
PHG23450Z DIP LED

Cuboid Head 2.0*3.0*4.0mm 2 Pins Green DIP LED

PHB23450Z-DIP-LED-light-view
PHB23450Z DIP LED

Cuboid Head 2.0*3.0*4.0mm  2 Pins Blue DIP LED

PHY23450Z-DIP-LED-light-view
PHY23450Z DIP LED

Cuboid Head 2.0*3.0*4.0mm  2 Pins Yellow DIP LED



The ways of LED lamps package

The ways of LED lamps package are various according to different kinds of application scenes, sizes, cooling plans and illumination effects. At present, the ways of LED package mainly are DIP-LED, SMD-LED, High-Power-LED etc.

DIP LED
In early stage, DIP LED was in-line LED and was embedment package. Here is the producing process. Liquid epoxy resin is injected in LED molding cavity firstly, and then LED bracket which has been welded is stabbed into the epoxy resin. After that, it is put into an oven for epoxy resin solidifying, and LED is separated from the molding cavity and done. Because of its relatively simple producing process and low cost, DIP LED has a high market share.

SMD LED
SMD LED which is attached to the surface of circuit board is suitable for surface mounted technology processing and it can be reflowed. It is very good to handle a series of problems that include: the brightness, the perspective, the smoothness, the reliability, the consistency and so on. Because it has chosen a lighter PCB plate and refection layer material, it has removed in-line LED heavy carbon steel pins and used lesser epoxy resin in reflective layer, it can easily save half size and weight. In this way, it can be used much more flexible.

High Power LED
In order to get high power and high brightness LED, LED manufacturers are devoted to developing high power LED chip and package. There are several watt power LED package technologies at present. The layout of package technology for Norlux series high power LED is multiple chips combination. And the hexagonal aluminum as the base is not conductive. The high power LED which base diameter is 31.75mm, diameter is (0.375*25.4)mm and illumination zone is in its center can contain 40 LED tube cores. Meanwhile, the aluminum plate is as the heat sink. This package has chosen the convention tube cores which are highly density assemble. Furthermore, it is high power, low high thermal resistance, and it has a high light output at high current. Therefore high power LED is a solid LED light source with great future.